! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
! Caution/Notice
C02E.pdf
Sep.25,2013
! Caution
c Storage and Operation Conditions ........................ 138
c Rating .................................................................... 138
1. Temperature Dependent Characteristics........... 138
2. Measurement of Capacitance............................ 138
3. Applied Voltage ................................................. 139
4. Type of Applied Voltage and
Self-heating Temperature .................................. 139
5. DC Voltage and AC Voltage Characteristics ..... 142
6. Capacitance Aging ............................................ 142
7. Vibration and Shock .......................................... 143
c Soldering and Mounting ........................................ 143
1. Mounting Position .............................................. 143
2. Information before Mounting.............................. 144
3. Maintenance of the Mounting
(pick and place) Machine................................... 144
4-1. Reflow Soldering ............................................ 145
4-2. Flow Soldering................................................ 146
4-3. Correction of Soldered Portion ....................... 147
5. Washing............................................................. 148
6. Electrical Test on Printed Circuit Board ............. 148
Notice
c Rating .................................................................... 153
1. Operating Temperature ..................................... 153
2. Atmosphere Surroundings ................................. 153
3. Piezo-electric Phenomenon............................... 153
c Soldering and Mounting ........................................ 153
1. PCB Design ....................................................... 153
1. Notice for Pattern Forms ............................... 153
2. Land Dimensions ........................................... 154
3. Board Design ................................................. 155
2. Adhesive Application ......................................... 156
3. Adhesive Curing ................................................ 156
4. Flux Application ................................................. 156
5. Flow Soldering ................................................... 156
6. Washing............................................................. 157
7. Coating .............................................................. 157
c Other ..................................................................... 157
1. Transportation ................................................... 157
2. Characteristics Evaluation
in the Actual System .......................................... 157
7. Printed Circuit Board Cropping .......................... 148
8. Assembly ........................................................... 151
9. Die Bonding/Wire Bonding ................................ 152
c Other ..................................................................... 152
1. Under Operation of Equipment .......................... 152
2. Other.................................................................. 152
137
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